GE 124 clear fused quartz, for quartz wafers and substrates, is produced from silica sand by electric fusion and therefore has a UV cutoff for 1mm thickness at <160 nm, a slight absorption at 245 nm and no appreciable absorption at 2.73 micrometers due to hydroxyl ions.
Nominal Purity: 99.999 W% SiO2
Wafer and substrates can be processed as large as 12" square or 12" diameter with almost perfect surface finish of <10/5 or 5-10 Angstroms. Many sizes available from stock ranging from .133" (3.4mm) square to 7.87" (200mm) diameter. Thicknesses range from ultra-thin < 100um to 250um, 500um, 1mm, 1.5mm, 2mm and up. Custom thicknesses and sizes also available.
Return to Home Page: Fused silica and fused quartz substrates and wafers
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Updated: 27 September 2008
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