Wafer dicing, substrate dicing and wafer backgrinding
Precision Wafer Dicing and Wafer Backgrinding
Precision wafer dicing services are provided for prototype and high volume dicing requirements. All dicing saws are fully programmable and equipped with high magnification optics for precision alignment.
Partial cut and break services are offered or 100% saw through on tape or other carrier. ESD protection available when required.
Precision Wafer Dicing Request for Quotation
Wafer and substrate dicing services for of standard materials like glass, quartz and silicon or need to develop dicing and cutting procedures for untried materials, Engineering will work with you to achieve your quality and product goals.
Required wafer dicing information:
Precision Wafer dicing Web sites:
Valley Design East
Phoenix Park Business Center
2 Shaker Road, Bldg. E-001
Shirley, MA 01464
Valley Design West
Santa Cruz, CA 95060